Dubbed CoolCube, the French research centre has developed a device scale-stacking technology for complex system-on-chips such as mobile processors which is why Qualcomm is collaborating with Leti.
The technology combines a stacking process with low-temperature transistor processing, which according to Leti allows vertical integration of a transistor without degrading the performance of the transistors beneath or the metal interconnects between the layers of the transistors.
"It also enables designers to include back-side imagers in chips, and co-integration of NEMS in a CMOS fabrication process," said Leti.
Semeria: sends a signal to IC community
Leti CEO Marie Semeria believes the involvement of Qualcomm Technologies in the CoolCube development sends "a strong signal to the microelectronics community.”
“Together, we aim to build a complete ecosystemwith foundries, equipment suppliers, and EDA and design houses to assemble all the pieces of the puzzle and move the technology into the product-qualification phase,” said Semeria.
The companies are looking for multi-party collaboration in the programme to drive adoption of the technology.
The two organisations have been working on the technology since 2014.
Karim Arabi, vice president of engineering, Qualcomm, writes:
“The Qualcomm Technologies and Leti teams have demonstrated the potential of this technology for designing and fabricating high-density and high-performance chips for mobile devices. We are optimistic that this technology could address some of the technology scaling issues.”
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